Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression

In this research, bump-shaped Vertically Aligned Multi-walled Carbon Nanotubes (VA-CNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VA-CNT bumps under compression pressure were studied. The resistance of the bonded VA-CNT bumps with load was decreased under compression pressure. In this model, it is considered that the VA-CNTs were deformed permanently by the friction among the VA-CNTs. In order to solve the cause of the permanent deformation of the VA-CNT bumps, the friction among the CNTs during the compression is calculated.