Wafer scale profiling of photonic integrated circuits
Hudgings, J.A.; Pipe, K.P.; Ram, R.J.
Lasers and Electro-Optics, 2003. CLEO apos;03. Conference on
Volume , Issue , 1-6 June 2003 Page(s): 2 pp. -
Digital Object Identifier   10.1109/CLEO.2003.1298028
Summary: We demonstrate a thermal profiling technique for wafer-scale testing of optical distribution in photonic integrated circuits. The technique is used to quantify the absorption coefficient of a subthreshold diode laser for varying operating conditions.

» View citation and abstract

Log in by entering your IEEE Web Account Username and Password.

IEEE Communications Society members: If you subscribe to the IEEE Electronic Periodicals Package or IEEE Electronic Periodicals Package Plus, you must access your subscription at www.comsoc.org.

Check with your librarian, information professional, or system manager to determine if you need to log in. Please complete the online Technical Support Form if you need assistance.

Select the Purchase History link to access the document. You will have 5 Days after purchase to access the Full Text PDF. Please complete the online Technical Support Form if you need assistance.

• Search and access Abstract records free of charge
• Register for table of contents alerts
• Purchase Full Text PDF documents

» Learn more about subscription options or how to become an IEEE Member.