New substrates for MOEMS

Bonded hydrophobic wafer pairs (PEW wafers) are applied as alternative substrates for optical devices (pin-diodes and complex MOEMS). Important parameters of diodes are analysed at temperatures up to 160/spl deg/C (dark current, photocurrent, CV-curves, rise time). Diodes produced on bonded hydrophobic wafer pairs show a similar or better behaviour than components prepared on the standard epitaxial wafers.