Highly sensitive inspection system for lithography-related faults in agile-fab detecting algorithm, monitoring and evaluation of yield impact

We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically.