Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates

High frequency signal distribution in HDI/HDW substrates can be achieved using optical interconnections. To realize effective milli- and micro-haul interconnections on these substrates, the hybrid integration of independently optimized interface circuits and optoelectronic detectors is critical. Further, to realize effective cost goals, designing the optoelectronic interface for alignment tolerance is a key goal. This paper describes the design, fabrication, and test of hybrid integrated optoelectronic interface circuits designed for alignment tolerance and for integration onto an HDI/HDW substrate.