Process and material handling models integration

AutoSimulations has developed and applied a new method of integrating separate models of manufacturing process and material handling systems that exploits the strengths of two different products to provide users with maximum productivity and flexibility. As applied to semiconductor wafer fabrication facilities in the examples presented, this approach replaces the traditional method of building a single large, complex model of the entire scope of operations. Two case studies illustrate the technique and demonstrate the benefits of this new modeling architecture. IBM recently contracted with AutoSimulations to upgrade an existing model of their prototype 300 mm wafer fabrication facility. The existing model was developed in 1997 using the AutoSched/sup TM/ application, a long-time manufacturing system modeling product from AutoSimulations. It incorporated various material handling systems and manufacturing processes within one model-the standard practice for modeling wafer fabrication facilities with the intent of understanding material handling requirements and process requirements for varying order demand. In 1998, Dominion Semiconductor, a subsidiary of IBM and Toshiba, contracted with AutoSimulations to develop a coordinated tool set to meet a diverse set of requirements to support their fabrication of 200 mm wafers. The manufacturing support group needed assistance in planning process capacity, in planning future staffing requirements, and in analysis of cost reduction initiatives and production scheduling, including lot start and dispatch policies.