BATEL-ball grid array technologies for advanced telecom applications. I

This paper describes the development of advanced thin chip scale BGA technologies within Europe as part of the ESPRIT research project 24366 BATEL 'Ball Grid Array Technologies for Advanced Telecom Applications'. LBGA 17/spl times/17 and LFBGA 12/spl times/12 with ball pitches of 0.8 mm have been developed using a matrix encapsulation technique. The materials, post mold warpage, electrical parasitics, and board level reliability have been characterised. Equipment for inspecting, handling and testing these fine pitch BGAs is described.