Process reliability qualification experiences during a fab relocation

The intent of this work is to provide information on the methodology, implementation, and results of reliability assessments enacted as part of new facility qualification. Three major processes were qualified using millions of element and thousands of lead product results. A qualification methodology is described which involves use of elements and products. Experience has shown that elemental tests are beneficial in precisely identifying failure mechanisms and the associated process capability. It is also shown that tests on wafers can provide similar results to packaged products, except that they can yield results in much shorter times. The timeline was particularly important for this fab move because of the compressed time schedule. The success of this work indicates that a methodology involving elements and circuits through similar stresses is appropriate to evaluate integrated circuit reliability for qualification testing and for continuous process capability monitoring.