Substrate integrated power combiners

In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.