2.5-Dimensional simulation for analyzing power arrays subject to ESD stresses

A new simulation-based methodology for analyzing the ESD performance of snapback multi-finger power arrays subject to ESD stress is developed and presented. The methodology utilizes a combination of a newly available 2.5-dimensional netlist extraction tool, ESD cell snapback compact model, and standard simulation CAD tools. Simulated snapback behavior and current distribution of power cells are demonstrated.