Motorola's PowerPC 603 and PowerPC 604 RISC microprocessor: the C4/ceramic-ball-grid array interconnect technology

The Motorola PowerPC 603 and PowerPC 604 microprocessors are available in the 21 mm controlled-collapsed-chip-connection/ceramic-ball-grid-array single-chip package (C4/CBGA). This paper will introduce the C4/CBGA interconnect technology and address the following: (1) the PCB land definition and board preparation requirements, (2) the ball-grid-array to board assembly methods, (3) the electrical design considerations, (4) the heat transfer mechanism and thermal control options, and (5) the CBGA-to-PCB testing and reliability.