Hybrid integration of optical and electronic components on a silicon motherboard

We have demonstrated silicon motherboard transmitter and receiver modules with planar silica waveguide optical interconnects. In both modules the active optoelectronic components were passively aligned to the silica waveguides, and electronic circuitry was also hybrid integrated. We are now- developing motherboards which include an electrical interconnect layer formed directly on the silicon, in order to overcome the limitations encountered with bond-wires.