Analysis of noise avoidance techniques in DSM interconnects using a complete crosstalk noise model

Noise estimation and avoidance are becoming critical, 'must have' capabilities in today's high performance IC design. An accurate yet efficient crosstalk noise model which contains as many driver/interconnect parameters as possible, is necessary for any sensitivity based noise avoidance approach. In this paper, we present a complete analytical crosstalk noise model which incorporates all physical properties including victim and aggressor drivers, distributed RC characteristics of interconnects and coupling locations in both victim and aggressor lines. We present closed-form analytical expressions for peak noise and noise width as well as sensitivities to all model parameters. We then use them model parameter sensitivities to analyze and evaluate various noise avoidance techniques such as driver sizing, wire sizing, wire spacing and layer assignment. Both our model and noise avoidance evaluations are verified using realistic circuits in 0.13/spl mu/ technology. We also present effectiveness of discussed noise avoidance techniques on a high performance microprocessor core.