CMP provides the access to advanced low cost manufacturing

CMP aims at providing universities, research laboratories and industries with the possibility of having their integrated circuit projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 /spl mu/m, DLM/TLM 0.6 /spl mu/m, DLP/4LM 0.35 /spl mu/m, SLP/6LM 0.25 /spl mu/m, SLP/6LM 0.18 /spl mu/m, BiCMOS DLP/DLM 0.8 /spl mu/m, SiGe HBT 0.8 /spl mu/m DLP/DLM, SiGe HBT 0.35 /spl mu/m SLP/5LM and GaAs HEMT 0.2 /spl mu/m. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8 /spl mu/m and 0.6 /spl mu/m, BiCMOS DLP/DLM 0.8 /spl mu/m and HEMT GaAs 0.2 /spl mu/m, using compatible front-side bulk micro-machining. MUMPS is offered as a surface micro-machining process, allowing one to integrate MEMS only microstructures. Finally, the main processes for Multi-Chip Modules (MCMs) are also available through CMP.