Metrology strategy for next generation semiconductor manufacturing

Metrology technology for the 100 nm and 70 nm generation faces many challenges. Although the areas of lithography, front end processes (transistor and capacitor fabrication), and (on chip) interconnect metrology are often considered independent, materials and process integration issues will drive a total picture viewpoint for next generation measurements. In this paper, the key measurement requirements and potential solutions are discussed in terms of a total solution. The results of recent studies will provide justification for the elements of the strategy.