Generalized image method with application to the thermal modeling of power devices and circuits

A new analytical thermal model of multilayer substrates is presented. Based on a generalization of the method of images, the model is straightforward to implement and allows a clearer understanding of the effect of geometric and material parameters on the temperature field. Approximate expressions for the thermal resistance in multilayer substrates are derived for the first time. The generalized image method can be applied to solve similar problems which involve the solution of the Laplace equation in composite domains consisting of several layers. Typical examples are problems of the electrostatics and ohmic conduction phenomena.