A novel ultra high dielectric constant epoxy silver composite for embedded capacitor application

Embedded capacitor technology can increase silicon efficiency of the electronic packaging, improve electrical performance, and reduce electronic assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB) for demanding wireless, RF portable telecommunication products. A novel epoxy-based composite with very ultra high dielectric constant (/spl epsiv//sub r//spl sim/1000) has been developed in this work. The previous record of /spl epsiv//sub r/=150 was only recently reported. To our best knowledge, this is the highest K value of the polymer-based composite ever reported. High dielectric constant is obtained by increasing the concentration of conductive filler close to but not exceed the percolation threshold within the polymer matrix. This novel ultra high K material also has low dielectric loss (<0.02), good adhesion and perfect multi-chip-module laminate (MCM-L) process compatibility. This novel composite is the perfect material candidate for the integral embedded capacitor applications for next generation electronic products.