Development of low temperature processing thermoplastic intrinsically conductive polymer

To find an alternative to reliable eutectic solder interconnects for electronics, MEMS and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50/spl deg/C and it exhibits stable resistance with gold under Jedec level 1, 85/spl deg/C/85% relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength.