High density, aspect ratio through-wafer electrical interconnect vias for low cost, generic modular MEMS packaging

The commercialization of Micro-Electro-Mechanical-Systems (MEMS) devices is hindered mainly due to association of high cost and inadequate solution of packaging. This paper outlines the current microsystem packaging challenges, and guides potential solutions for these problems. Low cost, generic and modular microsystem packaging designs are introduced, and the focus is on fabrication of high-density, aspect ratio through-wafer vias for electrical interconnect. In modern microsystem packaging, high input and output (I/O) is one of the key functional requirements, and this vertical electrical interconnection is intended for improved space efficiency. High aspect ratio through-wafer vias are dry etched followed by silicon dioxide insulation layer.