A silicon-etched probe for 3-D coordinate measurements with an uncertainty below 0.1 /spl mu/m

The increasing demand for accurate coordinate measurements on products demands new concepts of probe design. Results of some realized designs are given. One of the most promising utilizes microtechnology and etching in silicon in order to realize the necessary dimensional design with flexure hinges. Microtechnology is also used for the detection system; strain gages are integrated in the probe. Results for two probes are given and possible future developments are discussed.