An enhanced 130 nm generation logic technology featuring 60 nm transistors optimized for high performance and low power at 0.7 - 1.4 V

A leading edge 130 nm technology with 6 layers of Cu interconnects and 1.3 V operation has previously been presented (Tyagi et al., 2000). In this work, we enhance the previous technology with the following: transistor improvements which support a 60 nm gate dimension and increased drive current, improved 6-T SRAM device matching to allow low power and high performance operation from 0.7 to 1.4 V, and a 5% linear shrink to reduce the 6-T SRAM cell to 2.00 /spl mu/m/sup 2/ while still using 248 nm lithography. Saturation drive currents of 1.30 mA//spl mu/m for N-channel and 0.66 mA//spl mu/m for P-channel low VT devices are the highest reported to date. Excellent device short channel effects are obtained for the 60 nm gate length devices as measured by the 270 mV threshold voltage and <100 mV/V DIBL. These results have been achieved on both 200 and 300 mm wafers.