A method to improve the efficiency of CMP process

There are two important things when doing the CMP, one is the high removal rate, and the other is low nonuniformity. The factors, which may effect the result of polishing process, are pressure applied to wafer and the rotation speed of the wafer. In this study, the best polishing pressure distribution was studied. The effect of different boundary conditions between wafer and wafer carrier on the polishing pressure distribution was analyzed. The clearance between pad and wafer also analyzed.