Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 °C, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm
${\times } 130$
mm), highest resolution (
$1536 {\times } 1536$
pixels, 300 ppi) and lowest process temperature (100 °C) reported so far for the OPD based imagers.