Rapid MEMS prototyping using SU-8, wafer bonding and deep reactive ion etching

We describe a technique to rapidly prototype microelectromechanical systems by combining the use of (1) patterned SU-8 photoresist to form an electrically insulating spacer layer on a silicon substrate, (2) wafer bonding to affix single crystal silicon above the spacer layer, and (3) deep reactive ion etching to form suspended structures over the patterned spacer. Technical details of the wafer bonding process are presented. Experimental results from a rapidly prototyped test structure are shown. It is expected that this process will not be limited to silicon-based systems.