Identifying of Delamination in Integrated Circuits using Surface Acoustic Microscopy

In this paper we approbate a procedure for identification of delamination in integrated circuits mounted on printed circuit boards. It consists of consistent application of the following type of scans: A-scan, C-scan and C-scan with RTG option of surface acoustic microscopes. Our results are in coherence with other studies and techniques published in the literature and are better in terms of credibility of delamination detection.