Computing capacitances of vias in multilayered boards

The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Christoffel conformal mapping-finite difference procedure and the hybrid FEM/DBCI method. Different structures can be analyzed containing single or multiple ground planes, with finite or infinite thickness, with or without pads. Comparisons are made with other methods, showing that a greater accuracy is obtained by means of the two methods proposed.