A full-wave characterization of PCB having various ground plane shapes

An integral equation technique solved by the method of moment (MoM) is proposed to characterize planar interconnection lines printed on a dielectric substrate backed by a finite size arbitrarily ground plane shape. The ground plane topology effect on the current return is firstly highlighted thanks to the calculated current distribution. The effect of the finite size of the ground plane is then analyzed and evaluated on the propagation characteristics. The theoretical results of the radiated field are then compared with measurements where a good agreement is observed.