Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications

A method is presented for fabricating micro-air-channel structures encapsulated by a dielectric material using a sacrificial polymer based on polynorbornene (PNB) chemistry. A spin-coated film of PNB was patterned to define the exact geometry of the air-channels using conventional lithographic and etching techniques. The sacrificial polymer was encapsulated with a permanent dielectric material. The composite was then raised to elevated temperatures to produce gaseous products which permeate through the encapsulating material (SiO/sub 2/, SiN/sub x/ or other polymer) leaving behind minimal solid residue. Air-channels integrated with metal interconnections can be formed via a Damascene, or in-lay process. After patterning the sacrificial polymer, copper was electroplated, followed by encapsulation with the dielectric. Various issues pertaining to the processing steps have been investigated and are discussed, such as type of encapsulants, feasible air-channel sizes, and processing conditions. Such air-channel structures are believed to have potential applications in microelectronics, displays, printers, multilevel wiring boards, microscale chemical reactors on a chip, and microelectromechanical devices.