A study on the effectiveness of dummy pattern design existence in multi-layer PBGA application

In this paper, we will report our recent study results on the dummy pattern design effectiveness in multi layer PBGA (Plastic Ball Grid Array) packages focusing on final product quality of the semiconductor package. Until now, there is no experimental and empirical assessment on the effectiveness of dummy pattern existence which gives us the solid conviction in applying this concept in a high volume manufacturing scale in the PBGA industrial arena. This paper shows the detailed evaluation and experimental result with various design concepts of dummy patterns in multi layer PBGA substrates. From the thickness validation with same substrate manufacturing condition, to the overall PBGA package performance validation will be covered in this paper. Ball coplanarity and substrate thickness variation data will be reported with analytical simulation result.