Thermal characterization of plastic ball grid array packages via infrared thermography

A methodology for performing characterization of Plastic Ball Grid Array (PBGA) packages via Infrared Thermography (IRT) was established. The thermal performance of various assemblies was characterized using IRT in conjunction with analytical methods to determine the individual contributions of the PBGA package and of the printed wiring board. Accuracy and repeatability of temperature measurements via IRT were found to be equal to those obtained by thermocouple techniques using standard IEDEC methods. Additionally, IRT was found to provide significant advantages relative to conventional measurement techniques including increased resolution, space and time domain profiling capability, ease of use, and reduced sample preparation and measurement time.