Design and thermo-mechanical analysis of a Dimple-Array Interconnect technique for power semiconductor devices

A simple wireless-bond interconnect technique, termed Dimple-Array Interconnect (DAI) technique for packaging power devices and modules is presented in this paper. Electrical connections onto the devices are established by soldering arrays of dimples pre-formed on a metal sheet. Preliminary electrical and thermomechanical modeling results on a prototype DAI power module demonstrated potential advantages of this technique to include reduced parasitic noises, improved thermo-mechanical reliability, as well as lowered processing complexity.