Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation

The advanced 3D stacking technologies are discussed in this paper. They are the microbumping in 20 /spl mu/m pitch, the basic processes of the advanced bonding processes for the high precision and the reliable interconnections, the novel technologies to encapsulate the layered microthin gaps less than 10 /spl mu/m, and the non-destructive inspection. These technologies are confirmed to realize the 3D stacked LSI structure, and it will be expanded to the advanced system packaging technologies in the near future.