Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

Finite element modelling is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strong process and geometry dependent. Even for the same type of solder, measurements conducted by different people at different locations show different results, due to differences in application conditions, benching etc. Those differences may lead to difference in constitutive equations and/or the parameter values. Therefore the effect of the solder parameter variation and parameter sensitivity should be taken into account before a reliable solder fatigue prediction can be made. In this research, simulation-based optimisation method is used to investigate the sensitivity of the chosen solder parameters for the solder fatigue prediction using inelastic strain criterion.