A design and manufacturing solution for high-reliable, non-leaded CSPs like QFN

One of the new extremely miniaturized IC-packages, first presented by Matsushita under the designation QFN, has rapidly become popular with fast growing numbers. One concern is the limited device reliability, which requires improvements aimed from the main market like telecommunication and automotive electronic manufacturers. By carefully analyzing all the constraints which limits the device- and board assembly quality of such new devices by using all the experiences from the past and by taking in consideration the capabilities of existing and well established assembly and packaging technologies, it should be possible to build and economically manufacture such devices in high volume, achieving the required board assembly quality and device reliability in the requested cost frame.