Packaging using MEMS technologies and planar components

Three-dimensional millimeter-wave IC applying multi-layer BCB thin film and silicon micromachining technology was developed. Low loss characteristics were achieved by applying micromachining technology, despite being a quasi-planar structure, and a K-band filter was developed. Moreover, manufacture of the receiver front-end with built-in filter integrated into one package was realized by using flip-chip bonding techniques. Furthermore, we proposed an alternative BCB suspended structure and demonstrated a Ka-band antenna for the proposed package.