A practical PZT dry etching process that increases the top electrode contact reliability in pyroelectric detector arrays by using a MORI/sup TM/ high density plasma system

This paper describes a practical dry etching process for PZT. Results are presented that demonstrate a high rate, fence-free process that can be applied to thick PZT layers such as those used in pyroelectric detector arrays. The process relies upon the use of a MORI high density plasma system. When used in combination with a subsequent wet etch, it is possible to significantly improve the capacitor definition and maintain selectivity to the Pt electrode. The combined process results in an improvement in the reliability of the top electrode contact of such devices.