Process performance for Axcelis MC3 300 mm implanter

The process performance of the Axcelis Technologies MC3, medium current implanter for 300 mm wafers, is reviewed. The MC3 is based on an evolutionary design approach. It uses proven beam transport, electrostatic scanning, beam parallelism, and energy purity schemes based on the successful 8250/sub HT/ design. Metals contamination, beam parallelism, energy purity, particles, and dose uniformity and repeatability are reviewed. The results show that metals contamination, parallelism, and particle contamination are better than those for the 8250/sub HT/. Energy purity, dose repeatability and uniformity are similar to the ones achieved with 8250/sub HT/.