Quality improvement through SPC/DOE in SMT manufacturing

The paper addresses how to analyze and improve process quality in surface mount technology (SMT) manufacturing using multi-vari analysis (MVA), measurement system analysis (MSA), and design of experiment (DOE). The key process parameter (solder paste height) in the printing process has been optimized and defects caused by poor soldering have been reduced. The paper provides a good solution for increasing solderability of surface mount technology manufacturing through joint use of statistical process control (SPC) and DOE.