3D Coupled Electromagnetic-Thermal-Fluid Analysis of a Low Voltage Switchboard

The aim of this paper is a comparative analysis of 3D computer models of a low voltage switchboard. The models are developed in the program COMSOL. Models for the following types of problems have been developed: the coupled electromagnetic-thermal-fluid problem with taking into account the electromagnetic losses in the switchboard, the thermodynamic processes in the switchboard, the heat exchange by radiation and convection from the outer surface of the switchboard to the environment, as well as the distribution of the thermal flow along the supply cables; the coupled electric-thermal-fluid problem, without taking into account the eddy currents; the coupled electric-thermal problem without taking into account the eddy currents and the thermodynamic processes in the switchboard. Comparison between the obtained numerical results has been made.