Known good die achieved through wafer level burn-in and test

Motorola has developed and qualified a low-cost method to burn-in and test die at the wafer level rather than the historical die package level. This wafer level burn-in method utilizes a sacrificial metal circuit that is applied to the wafer at the post-fabrication process. The sacrificial metal circuit is designed so that each die is connected to adjacent dice to form die clusters. These clusters are electrically powered by a set signal, power, and ground circuitry. Sacrificial metal test pads allow contact to the cluster for burn-in and electrical testing. The test pads can be placed over active dice or around the wafer perimeter.