An algorithm for calculating the coupling between MMICs with block dielectric coverings

In this paper, a computer-aided design (CAD) algorithm is presented for determining the coupling between sealant covered monolithic microwave integrated circuits (MMICs) in a multichip module. It is assumed that the MMICs are sufficiently separated that near-field coupling can be neglected and that TM/sub 0/ parallel-plate fields dominate. It is also assumed that the MMICs are each covered by a sealant of size commensurate with the MMIC. The technique presented is computationally simple, appropriate for use with layout-based circuit CAD software, and uses no numerical electromagnetics. It has been tested by comparison to full-wave electromagnetic simulation. In simple test cases, this technique showed over two orders of magnitude increase in speed. For larger problems, the increase in speed will be more pronounced.