A multifunctional laser linking and cutting structure for standard 0.25 /spl mu/m CMOS-technology

A novel laser-switch has been developed, designed and manufactured in a standard 6 level metal CMOS process. The redimensioned laser-switches combine a laser link and via (fuse) corresponding to minimum design rules in a single device. Due to vertical arrangement of the linking and the cutting structure (via), an area reduction of more than 30% is achieved, compared to laser arrays utilizing traditional laser structures. Simultaneous connecting and disconnecting reduces the processing time by 50%, since an additional process step is omitted. The resistance of the formed link structures is very low (R/sub 12/spl times/12median/=0.065 /spl Omega/, R/sub 10/spl times/10median/=0.118 /spl Omega/). Optimal values have been found for laser parameters to process the cutting structure with 100% yield. A first estimation of life-time results in t/sub 0.1/=22 a. Arrangements of laser-switches for bus configuration and repair, and for overwriting static configuration signals are proposed.