Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state

The characteristics of thickening kinetics of the intermetallic compounds (IMC) (Cu/sub 6/Sn/sub 5/+Cu/sub 3/Sn) during aging at 120/spl deg/C and 90/spl deg/C in solid state were studied by quantitative metallographic analysis for three solder alloy systems: 40Sn-Bi/Cu, 40Sn-Bi-2Ag/Cu and Sn-37Pb/Cu. The diffusion couples were prepared by hot immersion in the molten solder bath. The results showed that the rate of the IMC thickening increases in the order Sn-37Pb/Cu<40Sn-Bi/2-Ag/Cu<40Sn-Bi/Cu. The IMC thickening rate in the Sn-Bi eutectic system is one order of magnitude faster than that in Sn-Pb eutectic system. The time exponents are different from each other. The relationship between the increase of IMC and aging time follows a parabolic function in the Sn-Pb system, and a linear relation in the Sn-Bi system. Addition of Ag in Sn-Bi inhibits the IMC thickening process.