Thermal optimisation of mechatronically integrated power electronics for an engine cooling fan using brushless technology

Mechatronical integration of power and control electronics directly into the actuators offers many advantages such as reduced costs, increased EMC, reduced volume or less weight. However mechatronical integration often is accompanied with undesired increase of thermal or mechanical loading of electronics. Computer-aided thermal/mechanical modelling and cosimulation of electronic housings for control and power electronics lead to optimised design of a mechatronical integrated solution for an engine cooling system. Thus critical temperatures for the devices can be avoided resulting in a reliable performance within the specifications. In addition total development time could be reduced considerably.