FDTD modeling of printed circuit board signal integrity and radiation

Increasing bus speeds between components on a printed circuit board (PCB) create many new problems for signal integrity (SI) and EMC engineers. Non-ideal ground paths can cause both signal integrity degradation and increased electromagnetic radiation. Another cause of radiation is the effects of a finite ground plane. This paper presents a study of the SI and EMC issues due to these structures based on finite-difference time-domain (FDTD) simulations.