Representation of thermal behavior of electronic components for the creation of a databank

Estimating the temperatures reached by integrated circuit chips using properties supplied by the manufacturer is not very accurate, given the reliability requirements of electronic systems. In order to remedy the lack of information a component databank is being set up. It is shown that using a more complex thermal network makes it possible to accurately represent the thermal behavior of components in the various possible cooling modes. The physical composition (dimensions, type of molding epoxy, etc.) of a given package can vary widely according to its origin, even when produced by the same manufacturer, since the specifications for these parameters are very broad or nonexistent. The degree of influence of each of these parameters is shown. A procedure to evaluate chip temperature with a reasonable margin of safety has been developed.<
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