Low stress moderate temperature reworkable adhesives for advanced MCM-D technology

A novel low stress moderate temperature reworkable (LSMTR) adhesive is reported in this paper. An elastomeric silicone was selected as base resin system to guarantee the low stress requirement for large scale MCM-D batch production. The reworkability of the adhesive was realized using a special catalyst, which was thermally stable at working temperature (200/spl deg/C) and decomposed completely after being held at reworkable temperature (250/spl deg/C) for 1h. Thermal and mechanical properties of the adhesive were characterized by Differential Scanning Calorimeter (DSC), Thermogravimetric Analyzer (TGA) and Dynamic Mechanical Analyzer (DMA), and the prototype test was conducted using silicone wafer and Kapton/sup R/ film as tiles and substrates, respectively. From this study, an effective method was explored for the development of new reworkable adhesives to meet various temperature requirements.