Component temperature prediction in printed circuit boards with boundary integral method

This paper covers temperature predictions in electronic assemblies with the boundary integral equation method (BIEM). It is applicable to any linear differential equation regardless of the boundary conditions, once it is intrinsically based on the effects superposition principle. The BIEM is applied to problems with and without isotropy. One advantage of the method is the simplicity and easiness of application to a large number of practical problems. To plates with isotropy, insulated borders, and bolt heat drains, the use of images allows a solution without using any grid. Experimental data and finite differences solutions are used to confirm the BIEM results.