IEEE electromagnetic compatibility society IEEE letters on electromagnetic compatibility practice and applications (L-EMCPA): Call for application letters

IEEE Letters on Electromagnetic Compatibility Practice and Applications (L-EMCPA) is a quarterly published letter journal that provides a rigorously peer-reviewed forum for rapid publication of 4 page letters describing practice, lessons learned and applications of the disciplines electromagnetic compatibility (EMC) and signal and power integrity (SIPI) as well as all relevant methods to predict, assesrandprevatlelecetomagnetlcintsrterenae(EMl) ani increase teriti/prodact immunity.