Effect of Waiting Time to Void Under Die for Snap Cure Process in Integrated Packaging

This research studied about reduction of void under die in die attach process. Die attach process is a very important process in the integrated circuit (IC) packaging. It is a popular adhesive material used for attaching between die and leadframe or substrate of a package which is an epoxy. Snap cure process is also important to make a complete epoxy due to cross linking to enhance microstructure of epoxy stiffness. The waiting time before snap cure process will affect the void under die of multichip package because the long duration of attaching will increase the risk of void under die. In experiment, the wait time before snap cure were varied from 0 until 8 hours with a step of 1 hour and analyzed the void under die of epoxy by die shear test, ball line thickness, delamination, x-ray and reliability test. The results confirmed that the wait time will affect the void under die of die attach process in IC packaging.